Stretchable and Bendable Microsystems

Our work on stretchable and bendable microsystems was featured in the GW Research Magazine.

The original paper on soft (i.e. stretchable and bendable) packaging of CMOS electronics with Microfluidics was published in Scientific Reports.

“Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics”, Sci Rep. 3: 1098, 2013.